Difference between pages "Transactional memory in hardware" and "Pressure sensitive adhesives"

Latest revision as of 06:43, 27 July 2015

1 Dashboard
2 Overview
3 Application of PSA
4 Making of PSAs
- 4.1 Effect of important parameters on PSA making and performance
5 PSA performance measurement
6 PSA products
7 Recycling issues with PSA
8 Search strategy
9 Market Information
10 Intellectual Property
- 10.1 Patent Search Table
11 Like this report?
12 Key findings
13 Analysis Sheet
14 Like this report?
15 Contact Dolcera

Dashboard

Dolcera dashboard provides quick and easy navigation through the technology segments. Below is the snapshot of how it look like. Click on the link Dolcera Dashboard for Pressure Sensitive Adhesives.

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Overview

Pressure sensitive adhesive (PSA, self adhesive, self stick adhesive) is adhesive that forms a bond when pressure is applied to marry the adhesive with the adherend. No solvent, water, or heat is needed to activate the adhesive. It is used in pressure sensitive tapes, labels, note pads, automobile trim, and a wide variety of other products.

As the name "pressure sensitive" indicates, the degree of bond is influenced by the amount of pressure which is used to apply the adhesive to the surface.

Surface factors such as smoothness, surface energy, removal of contaminants, etc. are also important to proper bonding.

PSAs are usually designed to form a bond and hold properly at room temperatures. PSAs typically reduce or lose their tack at cold temperatures and reduce their shear holding ability at high temperatures: Specialty adhesives are made to function at high or low temperatures. It is important to choose an adhesive formulation which is designed for its intended use conditions.

Surface Energy

Measuring of Surface Energy

Surface energy is a measure of how well an adhesive wets out over the surface of the material to which it is applied.
The most common method of determining the surface energy is to measure the contact angle of a water droplet on the substrate surface.
The contact angle between the solid and the fluid is the angle measured within the fluid, between the solid surface and the tangent plane to the liquid surface at the point of intersection.
A contact angle of greater than 90° indicates that the fluid (which is ink or adhesive in this case) has not wet the surface. Conversely an angle of less than 90° means that the fluid has wet the surface - if the angle approaches zero then the surface is completely wetted by the fluid.
The surface energy or the wetability of a particular substrate is measured in dynes/cm. Source

Low Surface Energy Substrates

Low energy plastics, such as polypropylene (PP), polyethylene (PE) and Teflon (PTFE) are essentially "non- stick" plastics.
Their molecular structure inhibits the adhesion and printing processes - this molecular structure is basically inert or inactive – these polymers are said to have a low surface energy.
Materials with low surface energy (LSE) do not allow adhesives to wet out, while materials with high surface energy (HSE) provide excellent wet-out, providing the best adhesion.
Rubber-based adhesives usually provide better adhesion to LSE surfaces.
Some substrates require special treatment such as corona treating, primers, top coating, etc., in order to achieve better adhesion.
On some LSE substrates, adhesion levels improve the longer adhesive is applied. Source

Adhesion

Adhesion is the molecular force of attraction between unlike materials.
Adhesion and cohesion, attractive forces between material bodies. A distinction is usually made between an adhesive force, which acts to hold two separate bodies together (or to stick one body to another) and a cohesive force, which acts to hold together the like or unlike atoms, ions, or molecules of a single body.
For example water molecules stick to each other. This is caused by hydrogen bonds that form between the slightly positive and negative ends of neighboring molecules.
Water is found in drops; perfect spheres. It’s hard to imagine water behaving any other way due to cohesion and water molecules stick to other surfaces due to adhesion.Source

Application of PSA

Application in electronics and electrical industry

Electrical grade PSAs are critical components in the design many of today's electrical and electronic components in the electrical industry. The construction of this type of PSA is difficult since lower concentration of conductive filler must be used in order to prevent the drying out of polymer by the conductive filler, with attendant loss of tack. The conductivity of electrically conductive PSA in the direction of pressure action is to a certain extend depend on the direction of pressure applied Florian, 2003

Electrical grade PSAs are designed and manufactured using materials using material that are physically and chemically stable in the presence of humidity and electrical stress. The acrylic high tack PSAs works very well in static and dynamic joints. The PSA agents are used in three forms i.e. modified aqueous dispersions or solutions in different solvents and as hot melts adhesives. PSA tapes find application in electronic assemblies Reliability of Pressure-Sensitive Adhesive Tapes for Heat Sink Attachment in Air-Cooled Electronic Assemblies

PSA tapes

Application in automobile industry

While mechanical fasteners will always be the choice when maximum torque and linear force are required in automobile industry, pressure-sensitive adhesives (PSAs) can often provide a better method of joining or bonding than traditional screws, nuts, bolts, rivets and welds.

The design, performance, and production reasons for replacing mechanical or fusion fastening methods with PSAs include, but are not limited to:

Distributing stress over the entire bonded area: The concentrated stress of mechanical fasteners can be eliminated and design engineers can specify lighter, thinner materials without sacrificing durability and product integrity.
Bonding dissimilar materials: The ability to bond two totally different substrates can yield a superior combination for product strength and performance. PSAs are an ideal counterbalance for varying factors of expansion between surfaces, such as laminating layers of metal.
Maintaining assembled substrate integrity: Less machining and finishing means more latitude for design engineers and improved aesthetics for greater consumer appeal.
Incorporating fatigue resistance: PSAs bring great flexibility, allowing for high extension and recovery under heavy loads.
Durability by design: PSAs fill voids and gaps and can bond loose-fitting parts.

Increasing production efficiency: PSAs reduce material requirements, provide product weight reduction, require fewer assembly and finishing steps, and minimize training FLEXcon white paper

Medical applications

There are two essential requirements of medical PSAs, that they should stick firmly to a difficult substrate (skin) and that they should be easily and cleanly removed from that substrate when desired. These requirements would seem to be in conflict: a high peel force usually signals the ability to stick firmly, while a low force is needed when removing dressings by peeling.

A number of ways have been considered to resolve this conflict. These may be divided into two broad categories: those that make the best of existing PSA technology, broadly taking a physical approach, and those that introduce novel chemistry into the process. Physical approaches consider such details as the dependence of peel force on peel angle, peel rate, backing materials, the deformation of the skin during peeling and use of barrier films and solvents. As an alternative to simply making the best of the physics of the peeling process, various workers have devised chemical systems for making the adhesive less strongly adhering at the time of removal. These systems usually consist of introducing a ‘switch’ mechanism into a strongly adhering adhesive so that its adherence may be reduced significantly at the time of removal by operation of the ‘switch’. Means of activating the ‘switch’ include: heat (warming or cooling), application of water via an absorbent backing and exposure to visible light. These may produce physical or chemical changes in the adhesive Chivers, 2001

PSAs drive transdermal delivery

Transdermal or through-the-skin delivery of drugs has assumed an important place in drug therapy, eliminating many of the shortcomings of syringes and pills. Active Transdermal Delivery Systems The three most commonly used adhesives used for transdermal delivery are polyisobutylenes, polyacrylates and silicones Tan and Pfister, 1999

Delivery to skin

In a typical disk drive, PSAs are applied to the base casting to secure the motor-mounting flange and motor assembly

Application in aerospace industry

Aerospace manufacturers uses PSAs to assemble sheet-metal components into sub assemblies. The aerospace industry, primarily satellite manufacturers, have expressed the need for a low outgas, thermally stable, adhesive tape which can work at both high, 175ºC, and low, -100ºC, temperatures. New silicone PSA was fabricated to pass, low outgassing requirements of 1% or less Total Mass Loss (TML) and 0.1% or less Collectable Volatile Condensable Materials (CVCM) Riegler, 2005.

Making of PSAs

Although PSPs can be obtained by different polymerization processes (i.e., emulsion, solution, hot-melt, or radiation curing), much attention has recently been devoted to the utilization of more environmentally friendly processes such as emulsion polymerization. Soft polymer networks are commonly used as previous termpressure sensitive adhesivesnext term (PSAs). This is due to their unique ability to deform and yet to resist flow. These contradictory requirements indicate that the mechanical properties are finely tuned, and that the types of deformation upon application are carefully considered. Variety of PSAs can be prepared by mixing a linear vinyl terminated polymer with a silane terminated f-functional cross-linker. Jensen et al., 2009

Sr. No.	PSA process	Chemical composition	Time of launch
1	Solvent-based	Rubber/resin, acrylics, silicones	Since 19th century
2	Hot-melt	Block copolymers, acrylics	1940s
3	Emulsion (water)-based	Acrylics, natural and synthetic rubber, ethylene-vinyl acetate copolymer	1970s
4	Radiation-cured	Acrylics, rubber	1970s

Sr. No.	Properties	Solvent-based: acrylic	Hot-melt: styrene-isobutylene-styrene.	Emulsion based: acrylics
1	PS performance	Excellent	Excellent	Very good
2	Ease of compounding	Moderate	Difficult	Easy
3	Formulation flexibility	Limited	Excellent	Moderate
4	Coating method flexibility	Limited	Poor	Excellent
5	Ease of changeover	Limited	Poor	Excellent
6	PSA reproducibility	Excellent	Limited	Excellent
7	Aging properties	Excellent	Poor	Excellent
8	Clarity/color	Excellent	Poor	Excellent
9	Safety/toxicity	Poor	Poor	Excellent
10	Raw material costs	High	Low	Medium
11	Coating/compounding costs	High	Medium	Low

Effect of important parameters on PSA making and performance

Effect of polymer molecular weight and crosslinking reactions on the end-use properties of PSAs

In a study wherein polymer molecular weight and polymer microstructure were regulated using different chain transfer agent (CTA) concentrations and by addition of a diacrylic monomer (MM) it was shown that all of the measured adhesion properties strongly depend on molecular weight of the synthesized polymer and on the amount of gel phase Kajtna et al., 2009

Effect of composition on Mechanical behaviours and fracture energy of PSAs

In a study it was shown that the mechanical behaviour depend on their composition but majority of fracture energy is dissipated on the first millimetre near the bending zone where fibrils elongation is maximum. Observations of interfaces between PSAs and glass substrate underline that fracture energy varies linearly according to the contact area Horgnies et al., 2007

Effect of tackifier on PSAs

To study the effect of tackifier (such as hydrogenated cyclo-aliphatic resin) a model system consisting of polystyrene-b-polyisoprene-b-polystyrene triblock copolymer was prepared. Tackifier increased the peel adhesion significantly and the increase became stronger above 40 wt% tackifier. The higher peel adhesion was obtained in the system with the larger amount of agglomerates of tackifier in the polyisoprene matrix. Sasaki et al., 2008

Effect of chain transfer agent and cross-linker concentration in making of PSAs

In a study it was shown that a constant cross-linker concentration, one can manipulate the polymer micro-structure by adding varying amounts of chain transfer agent. Three examples of these micro-structures are depicted below which show a tight gel network with long-chain sol polymers, a loose gel network with shorter sol polymers, and an imperfect gel structure with highly branched sol polymers. By manipulating the micro-structure, previous termpressure-sensitive adhesivenext term performance can be affected. Qie and Dube, 2010

Effect of chain transfer agent and cross-linker concentration in making of PSAs

Effect of flexible substrates on PSAs performance

The fracture energy (fracture toughness) of tapes during globally elastic unpeeling is often calculated from the relation G=P/b(1−cos θ). A study suggested that this expression is correct for elastic peeling from rigid substrates but it gives misleading results when peeling from reversible flexible substrates. Steven-Fountain et al., 2002

PSA performance measurement

PSAs polymeric materials effect tack, peel and shear strength . Inherent properties such as copolymer composition and microstructure, molecular weight and distribution are among the most influential factors affecting PSA properties directly as well as indirectly through their influence on physical properties (e.g., the glass transition temperature, Tg) and thus, rheological properties of the polymer (e.g., viscoelastic regions, moduli).

Therefore, PSA is the result of a fine balance between these three major, interrelated properties.

Tack

It is a measure of the force required to remove, say a foam gasket and its adhesive, from the substrate. It usually refers to the initial attraction of the adhesive to the substrate. Tack can be measured by four basic methods these are loop tack, rolling ball, Quick stick and probe measurement devices. Review Of Methods For The Measurement Of Tack

Peel strength

Peel strength is measured as a force required to remove a standard PSA strip from a specified test surface under a standard test angle (e.g., 90° or 180°) under standard conditions. Much like tack, manufacturers control adhesion to create different products based on user requirements. After a PSA has been applied to the substrate, adhesion continues to increase for a period of time — typically 24 hr.

Shear strength

Shear strength is the internal or cohesive strength of the adhesive mass. Usually, it is determined as the length of time it takes for a standard strip of PSA to fall from a test panel after application of a load. Usually, tack and adhesion decrease as shear strength increases. Emulsion-Based Pressure-Sensitive Adhesives: A Review

PSA products

The most common products that utilize PSAs are tapes, labels, and protective films. The PSA sector is among the fastest growing in the adhesive market, making the search for new pressure-sensitive products (PSP) and applications highly competitive.

PSA tapes: Self-adhesive materials usually produced by coating an adhesive onto a carrier and used as a continuous web.

PSA labels: Self-adhesive laminated carrier materials. The self-adhesive layer is protected with a supplemental material (release liner).

Protective films: Carrier material possesses built-in or built-on self-adhesive properties.

Recycling issues with PSA

PSAs exact a considerable cost on the paper recycling industry, an estimated $700 million per year. Most paper recycling systems converts paper into pulp in presence of water, which is then transformed back into paper. PSAs do not dissolve in water, but rather fragment into smaller particles during the repulping process. These particles are known as stickies, get deformed under heat and pressure, making them difficult to screen or filter out of the pulp. Stickies can become lodged on papermaking and can cause damage to equipment or even in the paper. Source

Sr. No.	"Sticky" PSA Product	Alternative Product/Procedure
1	Address Labels	1. Print addresses directly on envelopes 2. Using glassine (cellulose) film window or filmless window envelopes, and print mailing addresses directly on the letter to show through the window. 3. Handprint addresses directly on large mailing envelopes..
2	Sticky Notes	1.Use scratch paper for notes and secure with paper clips.
3	Postage Stamps	1. Use moisture-activated postage stamps 2. Postal meter that prints postage directly on envelopes or that uses moisture-activated meter tape
4	File Folder Index Labels	1. Handprint file subjects directly on index tabs, instead of using an index label. When recycling file folders with index labels, tear off the index tab.
5	Closure Tabs	1. Sharply folding fliers and newsletters is often sufficient to send them safely and securely through the mail.

Search strategy

Search strategy last updated on: 7th January 2011

Sr. No.	Search string	Hits
Google
1	Pressure sensitive adhesive making	7,510,000
2	Pressure sensitive adhesive application	7,650,000
3	Pressure sensitive adhesive automobile	436,000
4	Pressure sensitive adhesive automotive	479,000
5	Pressure sensitive adhesive drug delivery	275,000
6	Pressure sensitive adhesive tack*	354,000
7	Pressure sensitive adhesive product	8,120,000
8	Pressure sensitive adhesive recycl*	447,000
Google scholar
1	Pressure sensitive adhesive making	21,50,000
2	Pressure sensitive adhesive application	21,50,000
Scirus
1	Pressure sensitive adhesive making	130,055
2	Pressure sensitive adhesive application	200,950
3	Pressure sensitive adhesive product	136,169
Sciencedirect
1	Pressure sensitive adhesive electronics	2,450
2	Pressure sensitive adhesive making	7,212
3	Pressure sensitive adhesive application	15,405
4	Pressure sensitive adhesive automobile	951
5	Pressure sensitive adhesive automotive	1,406
6	Pressure sensitive adhesive drug delivery	2,876
Springerlink
1	Pressure sensitive adhesive making	2,149
2	Pressure sensitive adhesive application	3,901
Google images
1	Pressure sensitive adhesive making	3,580,000
2	Pressure sensitive adhesive application	2,210,000
3	Pressure sensitive adhesive electronics	1,690,000

Market Information

According to a report from the Business Communications Company, the 2001 US market for specialty adhesives was about $5.7 billion, and is forecast to grow at 4.3% per year, with medical and dental applications being the fastest-growing sector at 5.9% per year. Source
Frost and Sullivan report the size of the European PSA market (medical and non-medical) to be $620 million in 2000, forecast to grow to $796 million in 2007. Source
The world value of the overall adhesives market is estimated at US $22 billion.
Total Market Expected to Grow at a CAGR of 9 Percent: The U.S. PSA markets for labels and narrow-web graphics is expected to growth with a CAGR of 9 percent during the years 2006–2012. The total U.S. PSA markets for labels and narrow-web graphics unit shipments are expected to continue to growth at a CAGR of 6.6 percent due to high end-user growth. The UV technology is a new technology that have started to receive wide acceptance in the industry and that segment of the industry is a fragmented and developing segment with growth rates in double digits. While the solvent-based PSAs are expected to show decreasing growth percents, the water-based and solvent-based segments are expected to growth in the lines of the total industry. Source

According to World Adhesives File 2000-2005, the leading handful of adhesives suppliers, including pressure sensitive companies, already controlled almost half the global market in 1999. Henkel leads the way with an estimated 12% global market share, which will probably increase to around 14% with the purchase of Dexter’s adhesives interests. Pressure sensitive suppliers 3M and Avery Dennison are ranked second and third, with 9% and 7% shares respectively, followed jointly by National Starch and H.B. Fuller — both at 6%. The newly enlarged Atofina and Rohm and Haas follow closely behind.” Source
Growth of the world market averages about 2-3% per year.
Packaging adhesives make up the majority of the market.
The electronic and medical adhesives market is currently experiencing the most rapid growth.

Market leaders by country are as follows:
- United States - approximately 2.6 tonnes annually
- China
- Japan
- Germany
- UK
Market leaders by company(which account for one-third of the market share) are:
- Henkel
- 3M
- Avery Denison
- HB Fuller
- National Starch
- Atofina

Intellectual Property

Patent Search Table

Patent search on Micropat Databases searched: USG USA EPA EPB WO JP DEG DEA DET DEU GBA FRA
Query.No.	Searched Sections	Years Searched	Query	Hits
1	Claims, Title or Abstract	1836 – Date	(rubber OR acryl* OR silicone OR oil1 OR resin1 OR ethylen* OR isoprene OR terpene OR copolymer* OR vinyl* OR siloxane* ((acid OR anhydride) ADJ1 (acrylic OR crotonic OR (vinyl ADJ1 acetic) OR fumaric OR maleic OR malonic OR succinic OR itaconic OR citraconic)) OR polymer* OR styrene OR ester) SAME (((pressure ADJ1 sensitive) NEAR2 (adhesive OR glue OR paste OR (binding ADJ1 agent) OR (epoxy ADJ1 resin) OR film) OR PSA OR PSAs) OR (adhesion WITH (peel OR tensile OR shear) OR stick) OR (radical ADJ1 (initiator* OR maker*)))	76006
2	Claims, Title or Abstract	1836 – Date	(((low ADJ surface ADJ energy) WITH (substrate1 OR polymer OR compound OR material OR film)) OR (surface ADJ1 tension) OR (surface ADJ1 rough) OR viscosity OR (oily ADJ surface) OR (low ADJ1 energy ADJ1 surface)) AND (polyolefin1 OR polyethylene1 OR polypropylene1 OR (polyvinyl ADJ1 chloride ADJ1 film) OR (oil ADJ1 contaminated ADJ1 metal) OR polybutene OR polyisoprene1 OR (polyvinylidene ADJ1 fluoride) OR polytetrafluoroethylene1 OR polyester1 OR polyamide1 OR polyacetal1 OR polystyrene1 OR polyurethane* OR polyurea OR silan* OR polycarbonate*)	75602
3	Claims, Title or Abstract	1836 – Date	1 AND 2	2272

Total number of patents - 2272
Total number of unique patent families - 1483

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Taxonomy for analysis

Taxonomy map - Adhesion

Taxonomy for PSA composition

Taxonomy map - Adhesion

IP Activity

Major Competitors

Composition components matrix

Assignees	Rubber	Silicone	Polymers	Acrylic	Tackifying resin	Plasticizer oil	Carboxylic acids	Acid Esters	Priority Year	Patent numbers
3M Innovative Properties Company	x		x	x	x	x			2000	US6630531
	x		x	x	x				2000	US6632872
			x	x					2000	US6455634
			x	x				x	1993	US5612136
				x			x	x	1993	US5602221
American Tape Company	x					x			1997	US5798175
Ashland Oil, Inc.	x		x	x					1991	US5434213
Atlantic Richfield Company			x	x	x	x			1984	US4656213
	x		x	x	x				1996	US5817426
			x	x	x				1996	US5817426
	x			x					1997	US6461707
Coloplast	x		x		x				1980	US6437038
Dow Corning Corporation		x	x			x			1970	US5916981
		x	x						1990	US6337086
		x							1990	US6121368
		x	x						1994	US5561203
		x	x						1996	US5861472
Exxon Chemical Patents Inc.			x		x				1993	US5714254
Fujikura Ltd.									2000	US6388556
General Electric Company		x	x						2000	US6387487
H Fuller Licensing & Financing, Inc.	x		x	x	x	x			1996	US5741840
H. B. Fuller Licensing & Financing, Inc.	x		x		x				1997	US5869562
Johnson & Johnson Products Inc.	x		x		x	x			1981	US4335026
Nichiban Company Limited	x								1997	US6274235
None	x			x	x			x	1996	US20030136510
PPG Industries, Inc.	x		x	x			x		1996	US5776548
Ralf Korpman Associates, Inc.	x								1992	US5760135

Technology Tree

As it is evident from the the technology tree below, although the IP activity in the area of Pressure sensitive adhesive was initiated during 1970s, companies are continuously trying new combinations of different components.

Key findings

In the medical field, pressure-sensitive adhesive tapes are used for many different applications in the hospital and health areas and also they can be used to adhere two surfaces together such as the flaps of packing material or fabric to a surface
In many commercial applications of pressure-sensitive adhesives, it would be preferred to use an acrylate polymer or copolymer having an intrinsic viscosity of at least about 2.5 dl/g
Ideally, a process for producing an acrylate-based polymer for a pressure-sensitive adhesive provides a means for controlling both molecular weight, i.e., intrinsic viscosity, and molecular weight distribution.
Pressure-sensitive adhesives require a delicate balance of viscous and elastic properties that result in a four-fold balance of adhesion, cohesion, stretchiness and elasticity. Pressure-sensitive adhesives generally comprise elastomers that are either inherently tacky, or elastomers or thermoplastic elastomers that are tackified with the addition of tackifying resins.

Analysis Sheet

Sample Analysis Sheet

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@@ Line 1: / Line 1: @@
-==Background==
+==Dashboard==
-===Transactional memory===
+Dolcera dashboard provides quick and easy navigation through the technology segments. Below is the snapshot of how it look like. Click on the link [http://www.dolcera.com/auth/dashboard/dashboard.php?workfile_id=262 '''Dolcera Dashboard'''] for Pressure Sensitive Adhesives.
-*Transactional memory is a general and flexible way to allow programs to read and modify disparate primary memory locations atomically as a single operation, much as a database transaction can atomically modify many records on disk.
-*[http://en.wikipedia.org/wiki/Transactional_memory Transactional memory] attempts to simplify parallel programming by allowing a group of load and store instructions to execute in an atomic way. Transactional memory is a concurrency control mechanism analogous to database transactions for controlling access to shared memory in concurrent computing. A transaction is a piece of code that executes a series of reads and writes to shared memory.
-*Transactional memory (TM) supports code sections that are executed atomically, i.e., so that they appear to be executed one at a time, with no interleaving between their steps. TM significantly reduces the difficulty of writing correct concurrent programs. A good TM implementation avoids synchronization between concurrently executed transactional sections unless they actually conflict. TM can significantly improve the performance and scalability of concurrent programs, as well as makes them easier to write, understand and maintain.
-*[http://appft1.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PG01&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.html&r=1&f=G&l=50&s1=%2220070156994%22.PGNR.&OS=DN/20070156994&RS=DN/20070156994 Transactional memory] generally refers to a synchronization model that allows multiple threads to concurrently access a shared resource (such as a data structure stored in memory) without acquiring a lock as long as the accesses are non-conflicting, for example, as long as the accesses are directed to different portions of the shared resource.
-'''[[More details]]'''
-----
+[http://www.dolcera.com/auth/dashboard/dashboard.php?workfile_id=262 '''Dolcera Dashboard''']
-===Transactional programming models===
+[[image:dashboard.jpg|center|500 px]]
-*[http://research.sun.com/spotlight/2007/2007-08-13_transactional_memory.html Transactional programming models] can be supported in software using software-based transactional memory (STM), in hardware using hardware- based transactional memory (HTM), or in a combination of the two (Hybrid TM, or HyTM).
-**[http://en.wikipedia.org/wiki/Software_transactional_memory Software based Transactional memory] (STM) can allow sequences of concurrent operations to be combined into atomic transactions, thereby reducing the complexity of both programming and verification. STM is a scheme for concurrent programming with multiple threads that uses transactions similar to those used in databases.
-**Hardware based Transactional memory (HTM) system requires no read or write barriers within the transaction code. The hardware manages data versions and tracks conflicts transparently.
-**[http://www.eecs.harvard.edu/~fedorova/papers/asplos165-damron.pdf Hybrid Transactional memory] (HyTM) implements Transactional memory in software so that it can use best-effort Hardware Transactional memory (HTM) to boost performance but does not depend on HTM.
+==Overview==
+Pressure sensitive adhesive (PSA, self adhesive, self stick adhesive) is adhesive that forms a bond when pressure is applied to marry the adhesive with the adherend. No solvent, water, or heat is needed to activate the adhesive. It is used in pressure sensitive tapes, labels, note pads, automobile trim, and a wide variety of other products.
-===Software based Transactional memory===
+As the name "pressure sensitive" indicates, the degree of bond is influenced by the amount of pressure which is used to apply the adhesive to the surface.
-*Software transactional memory (STM) is implemented in software. All speculative STM transactional data is stored in the system memory and indicated to be in a non-committed state. When the STM transaction commits, any data the transaction writes is indicated as committed and subsequently available to other threads and transactions. In certain STM systems, a flag may be set to indicate the data as committed and accessible and available in memory to other transactions.
-====DracoSTM====
+Surface factors such as smoothness, surface energy, removal of contaminants, etc. are also important to proper bonding.
-*[http://eces.colorado.edu/~gottschl/dracoSTM/pubs/lcsd07-dracostm.pdf DracoSTM] is a high performance lock-based C++ Software Transactional memory research library. DracoSTM uses only native object-oriented language semantics, increasing its intuitiveness for developers while maintaining high programmability via automatic handling of composition, locks and transaction termination.
-*DracoSTM is a lock-based STM system. At its core, DracoSTM uses one lock per thread to implement transactional reads and writes. This allows multiple transactions to simultaneously read and write without blocking other transactions’ progress.
+PSAs are usually designed to form a bond and hold properly at room temperatures. PSAs typically reduce or lose their tack at cold temperatures and reduce their shear holding ability at high temperatures: Specialty adhesives are made to function at high or low temperatures. It is important to choose an adhesive formulation which is designed for its intended use conditions.
-====Dynamic STM (DSTM)====
+===Surface Energy===
-*[http://research.sun.com/scalable/pubs/PODC03.pdf Dynamic Software Transactional Memory (DSTM)] is a low-level application programming interface (API) for syn-chronizing shared data without using locks.
+[[Image:Surface energy.jpg|thumb|right|800|Measuring of Surface Energy]]
-*DSTM supports dynamic-sized data structures. DSTM has non-blocking implementation. The non-blocking property is obstruction-freedom. Dynamic means that the set of locations accessed by the transaction is not known in advance and is determined during its execution.
+# Surface energy is a measure of how well an adhesive wets out over the surface of the material to which it is applied.
-*DSTM techniques allow transactions and transactional objects to be created dynamically.Transactions may determine the sequence of objects to access based on the values observed in objects accessed earlier in the same transaction. DSTM is well suited to the implementation of dynamic-sized data structures such as lists and trees.
+# The most common method of determining the surface energy is to measure the contact angle of a water droplet on the substrate surface.
+# The contact angle between the solid and the fluid is the angle measured within the fluid, between the solid surface and the tangent plane to the liquid surface at the point of intersection.
+# A contact angle of greater than 90° indicates that the fluid (which is ink or adhesive in this case) has not wet the surface. Conversely an angle of less than 90° means that the fluid has wet the surface - if the angle approaches zero then the surface is completely wetted by the fluid.
+# The surface energy or the wetability of a particular substrate is measured in dynes/cm. [http://images.google.com/imgres?imgurl=http://www.pcn.org/images/Technical%2520Notes%2520-%2520Corona1.jpg&imgrefurl=http://www.pcn.org/Technical%2520Notes%2520-%2520Corona.html&h=327&w=370&sz=13&hl=en&start=2&um=1&tbnid=Nb4kgRrPYnxojM:&tbnh=108&tbnw=122&prev=/images%3Fq%3Dsurface%2Benergy%26svnum%3D10%26um%3D1%26hl%3Den%26sa%3DX Source]
+===Low Surface Energy Substrates===
+# Low energy plastics, such as polypropylene (PP), polyethylene (PE) and Teflon (PTFE) are essentially "non- stick" plastics.
+# Their molecular structure inhibits the adhesion and printing processes - this molecular structure is basically inert or inactive – these polymers are said to have a low surface energy.
+# Materials with low surface energy (LSE) do not allow adhesives to wet out, while materials with high surface energy (HSE) provide excellent wet-out, providing the best adhesion.
+# Rubber-based adhesives usually provide better adhesion to LSE surfaces.
+# Some substrates require special treatment such as corona treating, primers, top coating, etc., in order to achieve better adhesion.
+# On some LSE substrates, adhesion levels improve the longer adhesive is applied. [http://www.chemsultants.com/latestprods/adhesive_definitions.html Source]
-====Dynamic Software Transactional Memory 2.0 (DSTM2)====
+===Adhesion===
-*[http://research.sun.com/scalable/pubs/OOPSLA2006.pdf DSTM2] is a Java-based software library that provides a flexible framework for implementing STM. DSTM2 significantly improves the programming interface of its predecessor DSTM. The code is provided in Java libraries and any Java programmer can use it easily. DSTM2 allows researchers to plug in their STM implementations and directly compare them with others.
+[[Image:Adhesionnew.jpg|thumb|right|800|Adhesion]]
-*The DSTM2 library assumes that multiple concurrent threads share data objects. The DSTM2 library provides a new kind of thread that can execute transactions, which access shared atomic objects. DSTM2 threads provide methods for creating new atomic classes and executing transactions.
+# Adhesion is the molecular force of attraction between unlike materials.
+# Adhesion and cohesion, attractive forces between material bodies. A distinction is usually made between an adhesive force, which acts to hold two separate bodies together (or to stick one body to another) and a cohesive force, which acts to hold together the like or unlike atoms, ions, or molecules of a single body.
+# For example water molecules stick to each other. This is caused by hydrogen bonds that form between the slightly positive and negative ends of neighboring molecules.
+# Water is found in drops; perfect spheres. It’s hard to imagine water behaving any other way due to cohesion and water molecules stick to other surfaces due to adhesion.[http://images.google.com/imgres?imgurl=http://www.ccs.k12.in.us/chsBS/kons/kons/images/water-droplet.jpg&imgrefurl=http://www.ccs.k12.in.us/chsBS/kons/kons/physical_properties_of_water.htm&h=168&w=238&sz=15&hl=en&start=4&tbnid=UrmkX2TGv_os2M:&tbnh=77&tbnw=109&prev=/images%3Fq%3Dwater%2Badhesion%26gbv%3D2%26svnum%3D10%26hl%3Den%26sa%3DG Source]
-====Nonblocking Software Transactional Memory====
+==Application of PSA==
-*[http://research.sun.com/scalable/pubs/PPoPP2008-NBSTM.pdf Nonblocking STMs] are obstruction free. Nonblocking Software Transactional Memory guarantees that, if a transaction is repeatedly retried and eventually encounters no interference from other transactions, then eventually the transaction commits successfully.
-*Nonblocking STM “steals” ownership of a memory location from another transaction, rather than waiting for the other transaction to explicitly release it. Accessing stolen locations is more complicated and expensive than accessing unstolen ones, but stealing is worthwhile in order to avoid waiting for another transaction that is delayed for a long time.
-====<span style="color:#C41E3A">Like this report?</span>====
+===Application in electronics and electrical industry===
-<p align="center"> '''This is only a sample report with brief analysis''' <br>
-'''Dolcera can provide a comprehensive report customized to your needs'''</p>
+Electrical grade PSAs are critical components in the design many of today's electrical and electronic components in the electrical industry. The construction of this type of PSA is difficult since lower concentration of conductive filler must be used in order to prevent the drying out of polymer by the conductive filler, with attendant loss of tack. The conductivity of electrically conductive PSA in the direction of pressure action is to a certain extend depend on the direction of pressure applied [http://www.springerlink.com/content/j5448654801gg60q/ Florian, 2003]
-{|border="2" cellspacing="0" cellpadding="4" align="center" "
-|style="background:lightgrey" align = "center"  colspan = "3"|'''[mailto:info@dolcera.com <span style="color:#0047AB">Buy the customized report from Dolcera</span>]'''
+Electrical grade PSAs are designed and manufactured using materials using material that are physically and chemically stable in the presence of humidity and electrical stress. The acrylic high tack PSAs works very well in static and dynamic joints. The PSA agents are used in three forms i.e. modified aqueous dispersions or solutions in different solvents and as hot melts adhesives. PSA tapes find application in electronic assemblies [http://www.calce.umd.edu/articles/abstracts/2004/assemblies.htm Reliability of Pressure-Sensitive Adhesive Tapes for Heat Sink Attachment in Air-Cooled Electronic Assemblies]
+[[Image: PSA tapes.jpg|thumb|center|800px|[http://www.biztrademarket.com/User/166116/bb/insulation_tape_eho.jpg PSA tapes]]]
+===Application in automobile industry===
+While mechanical fasteners will always be the choice when maximum torque and linear force are required in automobile industry, pressure-sensitive adhesives (PSAs) can often provide a better method of joining or bonding than traditional screws, nuts, bolts, rivets and welds.
+The design, performance, and production reasons for replacing mechanical or fusion fastening methods with PSAs include, but are not limited to:
+# Distributing stress over the entire bonded area: The concentrated stress of mechanical fasteners can be eliminated and design engineers can specify lighter, thinner materials without sacrificing durability and product integrity.
+# Bonding dissimilar materials: The ability to bond two totally different substrates can yield a superior combination for product strength and performance. PSAs are an ideal counterbalance for varying factors of expansion between surfaces, such as laminating layers of metal.
+# Maintaining assembled substrate integrity: Less machining and finishing means more latitude for design engineers and improved aesthetics for greater consumer appeal.
+# Incorporating fatigue resistance: PSAs bring great flexibility, allowing for high extension and recovery under heavy loads.
+# Durability by design: PSAs fill voids and gaps and can bond loose-fitting parts.
+Increasing production efficiency: PSAs reduce material requirements, provide product weight reduction, require fewer assembly and finishing steps, and minimize training [http://www.flexcon.com/Resource-Center/~/media/Files/PDFs/Website/Resource%20Center/White%20Papers/design%20engineering%20aspects%20of%20pressure-sensitive%20adhesives.ashx FLEXcon white paper]
+===Medical applications===
+There are two essential requirements of medical PSAs, that they should stick firmly to a difficult substrate (skin) and that they should be easily and cleanly removed from that substrate when desired. These requirements would seem to be in conflict: a high peel force usually signals the ability to stick firmly, while a low force is needed when removing dressings by peeling.
+A number of ways have been considered to resolve this conflict. These may be divided into two broad categories: those that make the best of existing PSA technology, broadly taking a physical approach, and those that introduce novel chemistry into the process. Physical approaches consider such details as the dependence of peel force on peel angle, peel rate, backing materials, the deformation of the skin during peeling and use of barrier films and solvents. As an alternative to simply making the best of the physics of the peeling process, various workers have devised chemical systems for making the adhesive less strongly adhering at the time of removal. These systems usually consist of introducing a ‘switch’ mechanism into a strongly adhering adhesive so that its adherence may be reduced significantly at the time of removal by operation of the ‘switch’. Means of activating the ‘switch’ include: heat (warming or cooling), application of water via an absorbent backing and exposure to visible light. These may produce physical or chemical changes in the adhesive [http://www.sciencedirect.com/science?_ob=ArticleURL&_udi=B6TW7-43W00T1-3&_user=10&_coverDate=12%2F31%2F2001&_alid=1598193691&_rdoc=3&_fmt=high&_orig=search&_origin=search&_zone=rslt_list_item&_cdi=5555&_st=13&_docanchor=&view=c&_ct=15397&_acct=C000050221&_version=1&_urlVersion=0&_userid=10&md5=17b33208ec83c0db321e3d3882e5ffe3&searchtype=a Chivers, 2001]
+===PSAs drive transdermal delivery===
+Transdermal or through-the-skin delivery of drugs has assumed an important place in drug therapy, eliminating many of the shortcomings of syringes and pills. [http://www.adhesivesresearch.com/Pharmaceutical_ARx_LLC/Pharmaceutical/Component_Applications_And_Technologies/ActiveTransdermalDeliverySystems.aspx Active Transdermal Delivery Systems] The three most commonly used adhesives used for transdermal delivery are polyisobutylenes, polyacrylates and silicones [http://www.sciencedirect.com/science?_ob=ArticleURL&_udi=B6VJY-3WRB3HM-6&_user=10&_coverDate=02%2F01%2F1999&_rdoc=1&_fmt=high&_orig=search&_origin=search&_sort=d&_docanchor=&view=c&_searchStrId=1598124405&_rerunOrigin=google&_acct=C000050221&_version=1&_urlVersion=0&_userid=10&md5=f7968d61a743de54de6d04fb28c0cf00&searchtype=a Tan and Pfister, 1999]
+[[Image: Transdermal.jpg|thumb|center|600px|[http://www.qmed.com/files/ck_images/images/Nusil.jpg Delivery to skin]]]
+* In a typical '''disk drive''', PSAs are applied to the base casting to secure the motor-mounting flange and motor assembly
+===Application in aerospace industry===
+Aerospace manufacturers uses PSAs to assemble sheet-metal components into sub assemblies. The aerospace industry, primarily satellite manufacturers, have expressed the need for a low outgas, thermally stable, adhesive tape which can work at both high, 175ºC, and low, -100ºC, temperatures. New silicone PSA was fabricated to pass, low outgassing requirements of 1% or less Total Mass Loss (TML) and 0.1% or less Collectable Volatile Condensable Materials (CVCM) [http://www.polytec-pt.de/ger/_files/24_LowOutgasSiliconePressureSensitiveAdhesiveForAerospaceApplications2%281%29.pdf Riegler, 2005].
+==Making of PSAs==
+Although PSPs can be obtained by different polymerization processes (i.e., emulsion, solution, hot-melt, or radiation curing), much attention has recently been devoted to the utilization of more environmentally friendly processes such as emulsion polymerization. Soft polymer networks are commonly used as previous termpressure sensitive adhesivesnext term (PSAs). This is due to their unique ability to deform and yet to resist flow. These contradictory requirements indicate that the mechanical properties are finely tuned, and that the types of deformation upon application are carefully considered. Variety of PSAs can be prepared by mixing a linear vinyl terminated polymer with a silane terminated f-functional cross-linker. [http://www.sciencedirect.com/science?_ob=ArticleURL&_udi=B6TW7-4VJ4WRW-1&_user=10&_coverDate=10%2F31%2F2009&_alid=1598127284&_rdoc=6&_fmt=high&_orig=search&_origin=search&_zone=rslt_list_item&_cdi=5555&_sort=r&_st=13&_docanchor=&view=c&_ct=20058&_acct=C000050221&_version=1&_urlVersion=0&_userid=10&md5=31aa31be0a41e917372805a44d352007&searchtype=a Jensen et al., 2009]
+{|border="2" cellspacing="0" cellpadding="4" align = "center" width="70%"
+|align = "center" bgcolor = "#B8CCE4"|'''Sr. No.'''
+|align = "center" bgcolor = "#B8CCE4"|'''PSA process'''
+|align = "center" bgcolor = "#B8CCE4"|'''Chemical composition'''
+|align = "center" bgcolor = "#B8CCE4"|'''Time of launch'''
 |-
-| align = "center"| [http://www.dolcera.com/website_prod/services/ip-patent-analytics-services Patent Analytics Services]
+|align = "center" bgcolor = "#B8CCE4"|'''1'''
-|align = "center"| [http://www.dolcera.com/website_prod/services/business-research-services Market Research Services]
+|align = "center"|'''Solvent-based'''
-|align = "center"| [http://www.dolcera.com/website_prod/tools/patent-dashboard Purchase Patent Dashboard]
+|align = "center"|Rubber/resin, acrylics, silicones
+|align = "center"|Since 19th century
 |-
-|align = "center"| [http://www.dolcera.com/website_prod/services/ip-patent-analytics-services/patent-search/patent-landscapes Patent Landscape Services]
+|align = "center" bgcolor = "#B8CCE4"|'''2'''
-|align = "center"| [http://www.dolcera.com/website_prod/research-processes Dolcera Processes]
+|align = "center"|'''Hot-melt'''
-|align = "center"| [http://www.dolcera.com/website_prod/industries Industry Focus]
+|align = "center"|Block copolymers, acrylics
+|align = "center"|1940s
 |-
-|align = "center"| [http://www.dolcera.com/website_prod/services/ip-patent-analytics-services/patent-search/patent-landscapes Patent Search Services]
+|align = "center" bgcolor = "#B8CCE4"|'''3'''
-|align = "center"| [http://www.dolcera.com/website_prod/services/ip-patent-analytics-services/alerts-and-updates Patent Alerting Services]
+|align = "center"|'''Emulsion (water)-based'''
-|align = "center"| [http://www.dolcera.com/website_prod/tools Dolcera Tools]
+|align = "center"|Acrylics, natural and synthetic rubber, ethylene-vinyl acetate copolymer
+|align = "center"|1970s
+|-
+|align = "center" bgcolor = "#B8CCE4"|'''4'''
+|align = "center"|'''Radiation-cured'''
+|align = "center"| Acrylics, rubber
+|align = "center"|1970s
 |-
 |}
-<br>
-====[http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=3&f=G&l=50&co1=AND&d=PTXT&s1=transactional.TI.&s2=memory.TI.&OS=TTL/transactional+AND+TTL/memory&RS=TTL/transactional+AND+TTL/memory Non-blocking conditions]====
-=====Lock-free transactional memory=====
-*'''Lock-free transactional memory:''' A transactional memory implementation is lock-free if all its operations are lock-free and if some thread repeatedly attempts to commit transactions, then eventually some thread performs a successful commit.
-*'''Lock-freedom:''' An implementation of an operation is lock-free if after a finite number of steps of any execution of that operation, some operation execution completes (irrespective of the timing behavior of any concurrent operation executions).
-=====Wait-free transactional memory=====
+{|border="2" cellspacing="0" cellpadding="4" align = "center" width="80%"
-*'''Wait-free transactional memory:''' A transactional memory implementation is wait-free if all its operations are wait-free and any thread that repeatedly attempts to commit transactions eventually performs a successful commit.
+|align = "center" bgcolor = "#B8CCE4"|'''Sr. No.'''
-*'''Wait-freedom''': An implementation of an operation is wait-free if after a finite number of steps of any execution of that operation, that operation execution completes (irrespective of the timing behavior of any concurrent operation executions).
+|align = "center" bgcolor = "#B8CCE4"|'''Properties'''
+|align = "center" bgcolor = "#B8CCE4"|'''Solvent-based: acrylic'''
+|align = "center" bgcolor = "#B8CCE4"|'''Hot-melt: styrene-isobutylene-styrene.'''
+|align = "center" bgcolor = "#B8CCE4"|'''Emulsion based: acrylics'''
+|-
+|align = "center" bgcolor = "#B8CCE4"|'''1'''
+|align = "center"|PS performance
+|align = "center"|Excellent
+|align = "center"|Excellent
+|align = "center"|Very good
+|-
+|align = "center" bgcolor = "#B8CCE4"|'''2'''
+|align = "center"|Ease of compounding
+|align = "center"|Moderate
+|align = "center"|Difficult
+|align = "center"|Easy
+|-
+|align = "center" bgcolor = "#B8CCE4"|'''3'''
+|align = "center"|Formulation flexibility
+|align = "center"|Limited
+|align = "center"|Excellent
+|align = "center"|Moderate
+|-
+|align = "center" bgcolor = "#B8CCE4"|'''4'''
+|align = "center"|Coating method flexibility
+|align = "center"|Limited
+|align = "center"|Poor
+|align = "center"|Excellent
+|-
+|align = "center" bgcolor = "#B8CCE4"|'''5'''
+|align = "center"|Ease of changeover
+|align = "center"|Limited
+|align = "center"|Poor
+|align = "center"|Excellent
+|-
+|align = "center" bgcolor = "#B8CCE4"|'''6'''
+|align = "center"|PSA reproducibility
+|align = "center"|Excellent
+|align = "center"|Limited
+|align = "center"|Excellent
+|-
+|align = "center" bgcolor = "#B8CCE4"|'''7'''
+|align = "center"|Aging properties
+|align = "center"|Excellent
+|align = "center"|Poor
+|align = "center"|Excellent
+|-
+|align = "center" bgcolor = "#B8CCE4"|'''8'''
+|align = "center"|Clarity/color
+|align = "center"|Excellent
+|align = "center"|Poor
+|align = "center"|Excellent
+|-
+|align = "center" bgcolor = "#B8CCE4"|'''9'''
+|align = "center"|Safety/toxicity
+|align = "center"|Poor
+|align = "center"|Poor
+|align = "center"|Excellent
+|-
+|align = "center" bgcolor = "#B8CCE4"|'''10'''
+|align = "center"|Raw material costs
+|align = "center"|High
+|align = "center"|Low
+|align = "center"|Medium
+|-
+|align = "center" bgcolor = "#B8CCE4"|'''11'''
+|align = "center"|Coating/compounding costs
+|align = "center"|High
+|align = "center"|Medium
+|align = "center"|Low
+|-
+|}
-=====Obstruction-free transactional memory=====
+===Effect of important parameters on PSA making and performance===
-*'''Obstruction-free transactional memory:''' A transactional memory implementation is obstruction-free if all its operations are obstruction-free and if some thread repeatedly attempts to commit transactions, and runs in isolation after some point, then it eventually performs a successful commit.
-*'''Obstruction-freedom:''' An implementation of an operation is obstruction-free if every operation execution that executes in isolation after some point completes after a finite number of steps.
-===Hardware based Transactional memory===
+====Effect of polymer molecular weight and crosslinking reactions on the end-use properties of PSAs====
-*HTM comprises hardware transactions implemented entirely in processor hardware. For hardware transactions, data may be stored in hardware registers and cache, such that all cache actions are done atomically in hardware and data in the HTM is only written to the main memory upon committing the transaction. The HTM holds all the speculative writes without propagating to the main system memory, such as a Random Access Memory (RAM) device, until the transaction commits. If the hardware transaction aborts, then the cache lines holding the tentative writes in the HTM are discarded. HTM hardware transactions may utilize cache coherency protocols to detect and manage conflicts between HTM hardware transactions. The cache coherency protocols keep track of accesses within a hardware transaction. If two hardware transactions are accessing a same memory location, then the HTM aborts one transaction if there is a conflict, else the transaction's changes may be committed to the system memory.
+In a study wherein polymer molecular weight and polymer microstructure were regulated using different chain transfer agent (CTA) concentrations and by addition of a diacrylic monomer (MM) it was shown that all of the measured adhesion properties strongly depend on molecular weight of the synthesized polymer and on the amount of gel phase [http://www.sciencedirect.com/science?_ob=ArticleURL&_udi=B6TW7-4SH0Y17-1&_user=10&_coverDate=03%2F31%2F2009&_alid=1598127284&_rdoc=8&_fmt=high&_orig=search&_origin=search&_zone=rslt_list_item&_cdi=5555&_sort=r&_st=13&_docanchor=&view=c&_ct=20058&_acct=C000050221&_version=1&_urlVersion=0&_userid=10&md5=0c2fe11851b57347e066ff78a975a690&searchtype=a Kajtna et al., 2009]
-*HTM transactions usually require less overhead then STM transactions because HTM transactions occur entirely in hardware. HTM transactions may be limited to smaller transactions due to hardware limitations, whereas STM transactions can handle large and longer transactions. [http://appft1.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PG01&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.html&r=1&f=G&l=50&s1=%2220070143287%22.PGNR.&OS=DN/20070143287&RS=DN/20070143287 Source]
-*The multi-core processor '''Rock''' supports [http://research.sun.com/scalable/pubs/TRANSACT2008-ATMTP-Apps.pdf Hardware Transactional Memory] (HTM).
-*'''Rock'''’s HTM feature is an important but modest first step in integrating HTM support into a mainstream commercial multi-core processor.
-*'''Rock''' supports HTM with two new instructions, chkpt and commit, and a new checkpoint status (cps) register. A transaction is started by a chkpt instruction, and is terminated by either a commit instruction or the failure of the transaction. If a transaction fails, some indication of the cause of failure is stored in the cps register, and control is transferred to the PC-relative offset (fail pc) specified by the chkpt instruction.
-====Adaptive Transactional Memory Test Platform====
+====Effect of composition on Mechanical behaviours and fracture energy of PSAs====
-*The [http://www.cs.wisc.edu/gems/doc/gems-wiki/moin.cgi/ATMTP Adaptive Transactional Memory Test Platform] (ATMTP) provides a ﬁrst-order approximation of the success and failure characteristics of transactions on '''Rock'''. ATMTP will allow developers to test and tune their code for '''Rock'''.
+In a study it was shown that the mechanical behaviour depend on their composition but majority of fracture energy is dissipated on the first millimetre near the bending zone where fibrils elongation is maximum. Observations of interfaces between PSAs and glass substrate underline that fracture energy varies linearly according to the contact area [http://www.sciencedirect.com/science?_ob=ArticleURL&_udi=B6TW7-4N2D2V9-2&_user=10&_coverDate=12%2F31%2F2007&_alid=1598127284&_rdoc=16&_fmt=high&_orig=search&_origin=search&_zone=rslt_list_item&_cdi=5555&_sort=r&_st=13&_docanchor=&view=c&_ct=20058&_acct=C000050221&_version=1&_urlVersion=0&_userid=10&md5=6021375899d8929d9ec349bc3fd3c01d&searchtype=a Horgnies et al., 2007]
-*ATMTP correctly models '''Rock'''’s HTM-related instructions, and fairly accurately reflects most of the circumstances that cause '''Rock''' transactions to fail. ATMTP provides a good platform for experimenting with HTM-based code that will behave similarly on '''Rock'''.
-====Unbounded Hardware Transactional Memory (UHTM)====
+====Effect of tackifier on PSAs====
-*[http://supertech.csail.mit.edu/papers/xaction.pdf UHTM] is commited in-cache. When not possible, hardware “spills” transaction information into memory, allowing (essentially) unbounded transactions. UTM is more appealing for programmer, but is significantly more complicated. Unbounded means that there is no limit on the number of locations accessed by the transaction.
+To study the effect of tackifier (such as hydrogenated cyclo-aliphatic resin) a model system consisting of polystyrene-b-polyisoprene-b-polystyrene triblock copolymer was prepared. Tackifier increased the peel adhesion significantly and the increase became stronger above 40 wt% tackifier. The higher peel adhesion was obtained in the system with the larger amount of agglomerates of tackifier in the polyisoprene matrix. [http://www.sciencedirect.com/science?_ob=ArticleURL&_udi=B6TW7-4RJKX1T-1&_user=10&_coverDate=10%2F31%2F2008&_alid=1598155857&_rdoc=4&_fmt=high&_orig=search&_origin=search&_zone=rslt_list_item&_cdi=5555&_sort=r&_st=13&_docanchor=&view=c&_ct=18242&_acct=C000050221&_version=1&_urlVersion=0&_userid=10&md5=41c38a7bf066473704bf91918b843915&searchtype=a Sasaki et al., 2008]
-====Best-effort Hardware Transactional Memory====
+====Effect of chain transfer agent and cross-linker concentration in making of PSAs====
-*Best-effort Hardware Transactional Memory transactions are committed in-cache and aborted if they don’t fit. Best-effort Hardware Transactional Memory has simple design.Best-effort Hardware Transactional Memory violates Principle of Least Astonishment. Programmer should not have to think about cache mapping, cache size, cache organization, etc.
+In a study it was shown that a constant cross-linker concentration, one can manipulate the polymer micro-structure by adding varying amounts of chain transfer agent. Three examples of these micro-structures are depicted below which show a tight gel network with long-chain sol polymers, a loose gel network with shorter sol polymers, and an imperfect gel structure with highly branched sol polymers. By manipulating the micro-structure, previous termpressure-sensitive adhesivenext term performance can be affected. [http://www.sciencedirect.com/science?_ob=ArticleURL&_udi=B6TWW-4YG1M1T-3&_user=10&_coverDate=06%2F30%2F2010&_alid=1598155857&_rdoc=10&_fmt=high&_orig=search&_origin=search&_zone=rslt_list_item&_cdi=5573&_sort=r&_st=13&_docanchor=&view=c&_ct=18242&_acct=C000050221&_version=1&_urlVersion=0&_userid=10&md5=9b4d65da1531e13c4a9e3f5a986b03e4&searchtype=a Qie and Dube, 2010]
-*[http://research.sun.com/scalable/pubs/TRANSACT2008-ATMTP-Apps.pdf Best-effort HTM] does not guarantee to support transactions of any size and duration, and thus is free to simply abort transactions that exceed on-chip resources for HTM or encounter difficult events or situations.
-====Split Hardware Transaction (SpHT)====
+[[Image:Effect of CTA.jpg| thumb|center|300px|Effect of chain transfer agent and cross-linker concentration in making of PSAs]]
-*The [http://research.sun.com/scalable/pubs/PPoPP2008-SpHT.pdf Split Hardware Transaction (SpHT])uses minimal software support to combine multiple segments of an atomic block, each executed using a separate hardware transaction, into one atomic operation. The idea of segmenting transactions can be used for many purposes, including nesting, local retry, or Else, and user-level thread scheduling. SpHT overcomes the limited expressive power of best-effort HTM while imposing overheads dramatically lower than STM and preserving useful guarantees such as strong atomicity provided by the underlying HTM.
-====Virtualized Transactional Memory (VTM)====
+====Effect of flexible substrates on PSAs performance====
-*[http://www.cs.wisc.edu/trans-memory/misc-papers/moir:hybrid-tm:tr:2005.pdf Virtualized TM (VTM)] maintains atomicity and isolation even if a transaction is interrupted by a cache overflow or a system event. VTM maps the key bookkeeping data structures for transactional execution (read set, write set, write buffer or undo-log) to virtual memory, which is effectively unbounded and is unaffected by system interruptions. The hardware caches hold the working set of these data structures. VTM also suggested the use of hardware signatures to avoid redundant searches through structures in virtual memory.
+The fracture energy (fracture toughness) of tapes during globally elastic unpeeling is often calculated from the relation G=P/b(1−cos θ). A study suggested that this expression is correct for elastic peeling from rigid substrates but it gives misleading results when peeling from reversible flexible substrates. [http://www.sciencedirect.com/science?_ob=ArticleURL&_udi=B6TW7-46RKMVR-1&_user=10&_coverDate=12%2F31%2F2002&_alid=1598155857&_rdoc=14&_fmt=high&_orig=search&_origin=search&_zone=rslt_list_item&_cdi=5555&_sort=r&_st=13&_docanchor=&view=c&_ct=18242&_acct=C000050221&_version=1&_urlVersion=0&_userid=10&md5=5a2c01b1375cc8e2d6e2d69ed8cd8aa4&searchtype=a Steven-Fountain et al., 2002]
-====[http://research.microsoft.com/~larus/Papers/p80-larus.pdf Conflict detection]====
+==PSA performance measurement==
-*HTM systems rely on a computer’s cache hierarchy and the cache coherence protocol to implement conflict detection. Caches observe all reads and writes issued by a processor, can buffer a significant amount of data, and can be searched efficiently because of their associative organization. All HTMs modify the first-level caches, but the approach extends to higher-level caches, both private and shared.
-*Conflict detection occurs as other processors receive the coherence messages from the committing transaction. Hardware looks up the received block address in the local caches. If the block is in a cache and has its R or W bit set, there is a read-write or a  write-write conflict between the committing and the local transaction. The hardware signals a software handler, which aborts the local transaction and potentially retries it after a backoff period.
-*'''Direct memory updates:''' For direct updates, the hardware transparently logs the original value in a memory block before its first modification by a transaction. If the transaction aborts, the log is used to undo any memory updates.
-*'''Early conflict detection :''' For early conflict detection, the hardware acquires exclusive access to the cache block on the first write and maintains it until the transaction commits.
-===Hybrid Transactional memory (HyTM)===
+PSAs polymeric materials effect  tack, peel and shear strength . Inherent properties such as copolymer composition and microstructure, molecular weight and distribution are among the most influential factors affecting PSA properties directly as well as indirectly through their influence on physical properties (e.g., the glass transition temperature, Tg) and thus, rheological properties of the polymer (e.g., viscoelastic regions, moduli).
-*The HyTM approach is to provide an STM implementation that does not depend on hardware support beyond what is widely available today, and also to provide the ability to execute transactions using whatever HTM support is available in such a way that the two types of transactions can coexist correctly.
-*The key idea to achieving correct interaction between software transactions and hardware transactions is to augment hardware transactions with additional code that ensures that the transaction does not commit if it conflicts with an ongoing software transaction.
-====Phased Transactional Memory (PhTM)====
+Therefore, PSA is the result of a fine balance between these three major, interrelated properties.
-*[http://research.sun.com/scalable/pubs/TRANSACT2007-PhTM.pdf Phased Transactional Memory (PhTM])supports switching between different “phases”, each implemented by a different form of transactional memory support. PhTM allows to adapt between a variety of different transactional memory implementations.
-====Nonblocking Zero-Indirection Transactional Memory (NZTM)====
+===Tack===
-*[http://research.sun.com/scalable/pubs/TRANSACT2007-NZTM.pdf Nonblocking Zero-Indirection Transactional Memory (NZTM)] is a nonblocking, zero-indirection object-based hybrid transactional memory system. NZTM can execute transactions using best-effort hardware transactional memory or by using compatible software transactional memory system.
+It is a measure of the force required to remove, say a foam gasket and its adhesive, from the substrate. It usually refers to the initial attraction of the adhesive to the substrate. Tack can be measured by four basic methods these are loop tack, rolling ball, Quick stick and probe measurement devices. [http://www.adhesivestoolkit.com/Docu-Data/NPLDocuments/P%20A%20J/PAJ%20Reports/PAJ1%20Reports/PAJ1%20Report%205.pdf Review Of Methods For The Measurement Of Tack]
-====[http://research.microsoft.com/~larus/Papers/p80-larus.pdf Hardware-Accelerated STM (HASTM)]====
+===Peel strength===
-*Hardware-Accelerated STM (HASTM) system proposes hardware support to reduce the overhead of STM instrumentation. The supplementary hardware allows software to build fast filters that could accelerate the common case of read set maintenance.
-*HASTM provides the STM with two capabilities through per-thread mark bits at the granularity of cache blocks.
-*'''Conflict detection:''' Software can check if a mark bit was previously set for a given block of memory and that no other thread wrote to the block since it was marked.
-*'''Validation:''' Software can query if potentially there were writes by other threads to any of the memory blocks that the thread marked.
-====[http://research.microsoft.com/~larus/Papers/p80-larus.pdf Signature-Accelerated STM (SigTM)]====
+Peel strength is measured as a force required to remove a standard PSA strip from a specified test surface under a standard test angle (e.g., 90° or 180°) under standard conditions. Much like tack, manufacturers control adhesion to create different products based on user requirements. After a PSA has been applied to the substrate, adhesion continues to increase for a period of time — typically 24 hr.
-*[http://portal.acm.org/citation.cfm?id=1250673 Signature-Accelerated STM (SigTM)]uses hardware signatures to encode the read set and write set for software transactions. A hardware Bloom filter outside of the caches computes the signatures.b Software instrumentation provides the filters with the addresses of the objects read or written within a transaction. To detect conflicts, hardware in the computer monitors coherence traffic for requests for exclusive accesses to a cache block, which indicates a memory update.
-*The hardware tests if the address in a request is potentially in a transaction’s read or write set by examining the transaction’s signatures. If so, the memory reference is a potential conflict and the STM can either abort a transaction or turn to software validation.
-----
+===Shear strength===
+Shear strength is the internal or cohesive strength of the adhesive mass. Usually, it is determined as the length of time it takes for a standard strip of PSA to fall from a test panel after application of a load. Usually, tack and adhesion decrease as shear strength increases. [http://www.informaworld.com/smpp/section?content=a713642457&fulltext=713240928 Emulsion-Based Pressure-Sensitive Adhesives: A Review]
+==PSA products==
+The most common products that utilize PSAs are tapes, labels, and protective films. The PSA sector is among the fastest growing in the adhesive market, making the search for new pressure-sensitive products (PSP) and applications highly competitive.
+* '''PSA tapes:''' Self-adhesive materials usually produced by coating an adhesive onto a carrier and used as a continuous web.
+* '''PSA labels:''' Self-adhesive laminated carrier materials. The self-adhesive layer is protected with a supplemental material (release liner).
+* '''Protective films:''' Carrier material possesses built-in or built-on self-adhesive properties.
+==Recycling issues with PSA==
+PSAs exact a considerable cost on the paper recycling industry, an estimated $700 million per year. Most paper recycling systems converts paper into pulp in presence of water, which is then transformed back into paper. PSAs do not dissolve in water, but rather fragment into smaller particles during the repulping process. These particles are known as stickies, get deformed under heat and pressure, making them difficult to screen or filter out of the pulp. Stickies can become lodged on papermaking and can cause damage to equipment or even in the paper.  [http://www.calrecycle.ca.gov/ReduceWaste/Business/officepaper/PSAFacts.htm Source]
+{|border="2" cellspacing="0" cellpadding="4" align = "center" width="90%"
+|align = "center" bgcolor = "#B8CCE4"|'''Sr. No.'''
+|align = "center" bgcolor = "#B8CCE4"|'''"Sticky" PSA Product'''
+|align = "center" bgcolor = "#B8CCE4"|'''Alternative Product/Procedure'''
+|-
+|align = "center" bgcolor = "#B8CCE4"|'''1'''
+|align = "center"|Address Labels
+|align = "left"|1. Print addresses directly on envelopes<br>2. Using glassine (cellulose) film window or filmless window envelopes, and print mailing addresses directly on the letter to show through the window.<br>3. Handprint addresses directly on large mailing envelopes..
+|-
+|align = "center" bgcolor = "#B8CCE4"|'''2'''
+|align = "center"|Sticky Notes
+|align = "left"|1.Use scratch paper for notes and secure with paper clips.
+|-
+|align = "center" bgcolor = "#B8CCE4"|'''3'''
+|align = "center"|Postage Stamps
+|align = "left"|1. Use moisture-activated postage stamps<br>2. Postal meter that prints postage directly on envelopes or that uses moisture-activated meter tape
+|-
+|align = "center" bgcolor = "#B8CCE4"|'''4'''
+|align = "center"|File Folder Index Labels
+|align = "left"|1. Handprint file subjects directly on index tabs, instead of using an index label. When recycling file folders with index labels, tear off the index tab.
+|-
+|align = "center" bgcolor = "#B8CCE4"|'''5'''
+|align = "center"|Closure Tabs
+|align = "left"|1. Sharply folding fliers and newsletters is often sufficient to send them safely and securely through the mail.
+|-
+|}
 ==Search strategy==
-=== English Search concepts===
-{|border="2" cellspacing="0" cellpadding="4" width="100%"
+Search strategy last updated on: 7th January 2011
-| style="background-color:#B6DDE8;padding:0.079cm;" width="4%"| <center>'''S. No.'''</center>
-| style="background-color:#B6DDE8;padding:0.079cm;" width="20%"| <center>'''Transactional memory'''</center>
+{|border="2" cellspacing="0" cellpadding="4" align = "center" width="60%"
-| style="background-color:#B6DDE8;padding:0.079cm;" width="20%"| <center>'''Atomic memory transactions'''</center>
+|align = "center" bgcolor = "#95B3D7"|'''Sr. No.'''
-| style="background-color:#B6DDE8;padding:0.079cm;" width="20%"| <center>'''Concurrency control'''</center>
+|align = "center" bgcolor = "#95B3D7"|'''Search string'''
-| style="background-color:#B6DDE8;padding:0.079cm;" width="20%"| <center>'''Shared memory access'''</center>
+|align = "center" bgcolor = "#95B3D7"|'''Hits'''
 |-
-| style="background-color:#B6DDE8;padding:0.079cm;"| <center>'''1'''</center>
+|align = "center" bgcolor = "#C5BE97" colspan = "3"|'''Google'''
-| style="padding:0.079cm;"| Transactional memory
-| style="padding:0.079cm;"| Atomic memory transactions
-| style="padding:0.079cm;"| Concurrency control
-| style="padding:0.079cm;"| Shared memory synchronization
 |-
-| style="background-color:#B6DDE8;padding:0.079cm;"| <center>'''2'''</center>
+|align = "center" bgcolor = "#95B3D7"|'''1'''
-| style="padding:0.079cm;"| Transactional execution AND memory
+|align = "center"|Pressure sensitive adhesive making
-| style="padding:0.079cm;"| Atomically memory accesses
+|align = "center"|7,510,000
-| style="padding:0.079cm;"| Concurrent computing
-| style="padding:0.079cm;"| Shared memory access
 |-
-| style="background-color:#B6DDE8;padding:0.079cm;"| <center>'''3'''</center>
+|align = "center" bgcolor = "#95B3D7"|'''2'''
-| style="padding:0.079cm;"| Hybrid transactional memory
+|align = "center"|Pressure sensitive adhesive application
-| style="padding:0.079cm;"|
+|align = "center"|7,650,000
-| style="padding:0.079cm;"|
-| style="padding:0.079cm;"|
 |-
-| style="background-color:#B6DDE8;padding:0.079cm;"| <center>'''4'''</center>
+|align = "center" bgcolor = "#95B3D7"|'''3'''
-| style="padding:0.079cm;"| Software transactional memory
+|align = "center"|Pressure sensitive adhesive automobile
-| style="padding:0.079cm;"|
+|align = "center"|436,000
-| style="padding:0.079cm;"|
-| style="padding:0.079cm;"|
 |-
-| style="background-color:#B6DDE8;padding:0.079cm;"| <center>'''5'''</center>
+|align = "center" bgcolor = "#95B3D7"|'''4'''
-| style="padding:0.079cm;"| Hardware transactional memory
+|align = "center"|Pressure sensitive adhesive automotive
-| style="padding:0.079cm;"|
+|align = "center"|479,000
-| style="padding:0.079cm;"|
-| style="padding:0.079cm;"|
-|}
+|-
+|align = "center" bgcolor = "#95B3D7"|'''5'''
+|align = "center"|Pressure sensitive adhesive drug delivery
+|align = "center"|275,000
-=== French Search concepts===
+|-
-{|border="2" cellspacing="0" cellpadding="4" width="100%"
+|align = "center" bgcolor = "#95B3D7"|'''6'''
-| style="background-color:#B6DDE8;padding:0.079cm;" width="4%"| <center>'''S. No.'''</center>
+|align = "center"|Pressure sensitive adhesive tack*
-| style="background-color:#B6DDE8;padding:0.079cm;" width="20%"| <center>'''Transactional memory'''</center>
+|align = "center"|354,000
-| style="background-color:#B6DDE8;padding:0.079cm;" width="20%"| <center>'''Atomic memory transactions'''</center>
-| style="background-color:#B6DDE8;padding:0.079cm;" width="20%"| <center>'''Concurrency control'''</center>
-| style="background-color:#B6DDE8;padding:0.079cm;" width="20%"| <center>'''Shared memory access'''</center>
 |-
-| style="background-color:#B6DDE8;padding:0.079cm;"| <center>'''1'''</center>
+|align = "center" bgcolor = "#95B3D7"|'''7'''
-| style="padding:0.079cm;"| mémoire transactionnelle
+|align = "center"|Pressure sensitive adhesive product
-| style="padding:0.079cm;"| opérations&nbsp;de mémoire&nbsp;atomique
+|align = "center"|8,120,000
-| style="padding:0.079cm;"| contrôle de&nbsp;concurrence
-| style="padding:0.079cm;"| La synchronisation de mémoire partagée
 |-
-| style="background-color:#B6DDE8;padding:0.079cm;"| <center>'''2'''</center>
+|align = "center" bgcolor = "#95B3D7"|'''8'''
-| style="padding:0.079cm;"| l'exécution&nbsp;des transactions AND mémoire
+|align = "center"|Pressure sensitive adhesive recycl*
-| style="padding:0.079cm;"| accès à la mémoire&nbsp;atomique
+|align = "center"|447,000
-| style="padding:0.079cm;"| programmation concurrente
-| style="padding:0.079cm;"| Accès à la mémoire partagée
 |-
-| style="background-color:#B6DDE8;padding:0.079cm;"| <center>'''3'''</center>
+|align = "center" bgcolor = "#C5BE97" colspan = "3"|'''Google scholar'''
-| style="padding:0.079cm;"| hybride&nbsp;mémoire transactionnelle
-| style="padding:0.079cm;"|
-| style="padding:0.079cm;"|
-| style="padding:0.079cm;"|
 |-
-| style="background-color:#B6DDE8;padding:0.079cm;"| <center>'''4'''</center>
+|align = "center" bgcolor = "#95B3D7"|'''1'''
-| style="padding:0.079cm;"| mémoire&nbsp;logiciel transactionnel
+|align = "center"|Pressure sensitive adhesive making
-| style="padding:0.079cm;"|
+|align = "center"|21,50,000
-| style="padding:0.079cm;"|
-| style="padding:0.079cm;"|
 |-
-| style="background-color:#B6DDE8;padding:0.079cm;"| <center>'''5'''</center>
+|align = "center" bgcolor = "#95B3D7"|'''2'''
-| style="padding:0.079cm;"| mémoire matérielle transactionnel
+|align = "center"|Pressure sensitive adhesive application
-| style="padding:0.079cm;"|
+|align = "center"|21,50,000
-| style="padding:0.079cm;"|
-| style="padding:0.079cm;"|
-|}
+|-
+|align = "center" bgcolor = "#C5BE97" colspan = "3"|'''Scirus'''
-=== German Search concepts===
+|-
-{|border="2" cellspacing="0" cellpadding="4" width="100%"
+|align = "center" bgcolor = "#95B3D7"|'''1'''
-| style="background-color:#B6DDE8;padding:0.079cm;" width="4%"| <center>'''S. No.'''</center>
+|align = "center"|Pressure sensitive adhesive making
-| style="background-color:#B6DDE8;padding:0.079cm;" width="20%"| <center>'''Transactional memory'''</center>
+|align = "center"|130,055
-| style="background-color:#B6DDE8;padding:0.079cm;" width="20%"| <center>'''Atomic memory transactions'''</center>
-| style="background-color:#B6DDE8;padding:0.079cm;" width="20%"| <center>'''Concurrency control'''</center>
-| style="background-color:#B6DDE8;padding:0.079cm;" width="20%"| <center>'''Shared memory access'''</center>
 |-
-| style="background-color:#B6DDE8;padding:0.079cm;"| <center>'''1'''</center>
+|align = "center" bgcolor = "#95B3D7"|'''2'''
-| style="padding:0.079cm;"| transaktionalen Speicher
+|align = "center"|Pressure sensitive adhesive application
-| style="padding:0.079cm;"| Atom-Speicher-Transaktionen
+|align = "center"|200,950
-| style="padding:0.079cm;"| Concurrency Kontrolle
-| style="padding:0.079cm;"| Shared-Memory-Synchronisation
 |-
-| style="background-color:#B6DDE8;padding:0.079cm;"| <center>'''2'''</center>
+|align = "center" bgcolor = "#95B3D7"|'''3'''
-| style="padding:0.079cm;"| transaktionale&nbsp;Ausführung AND Speicher
+|align = "center"|Pressure sensitive adhesive product
-| style="padding:0.079cm;"| atomar&nbsp;Speicherzugriffe
+|align = "center"|136,169
-| style="padding:0.079cm;"| Concurrent&nbsp;Computing
-| style="padding:0.079cm;"| Shared-Memory-Zugriff
 |-
-| style="background-color:#B6DDE8;padding:0.079cm;"| <center>'''3'''</center>
+|align = "center" bgcolor = "#C5BE97" colspan = "3"|'''Sciencedirect'''
-| style="padding:0.079cm;"| Hybrid&nbsp;transaktionalen Speicher
-| style="padding:0.079cm;"|
-| style="padding:0.079cm;"|
-| style="padding:0.079cm;"|
 |-
-| style="background-color:#B6DDE8;padding:0.079cm;"| <center>'''4'''</center>
+|align = "center" bgcolor = "#95B3D7"|'''1'''
-| style="padding:0.079cm;"| Software&nbsp;transaktionalen Speicher
+|align = "center"|Pressure sensitive adhesive electronics
-| style="padding:0.079cm;"|
+|align = "center"|2,450
-| style="padding:0.079cm;"|
-| style="padding:0.079cm;"|
 |-
-| style="background-color:#B6DDE8;padding:0.079cm;"| <center>'''5'''</center>
+|align = "center" bgcolor = "#95B3D7"|'''2'''
-| style="padding:0.079cm;"| Hardware transaktionalen Speicher
+|align = "center"|Pressure sensitive adhesive making
-| style="padding:0.079cm;"|
+|align = "center"|7,212
-| style="padding:0.079cm;"|
-| style="padding:0.079cm;"|
-|}
+|-
+|align = "center" bgcolor = "#95B3D7"|'''3'''
+|align = "center"|Pressure sensitive adhesive application
+|align = "center"|15,405
+|-
+|align = "center" bgcolor = "#95B3D7"|'''4'''
+|align = "center"|Pressure sensitive adhesive automobile
+|align = "center"|951
-===Search strings===
-{|border="2" cellspacing="0" cellpadding="4" width="100%" align="left"
-|align = "center" bgcolor = "#FFFF99"|'''Concepts'''
-|align = "center" bgcolor = "#FFFF99"|'''Scope'''
-|align = "center" bgcolor = "#FFFF99"|'''Search string'''
-|align = "center" bgcolor = "#FFFF99"|'''No of hits'''
-|align = "center" bgcolor = "#FFFF99"|''' '''
 |-
-|align = "center" bgcolor = "#FFFF99"|'''Transactional memory'''
+|align = "center" bgcolor = "#95B3D7"|'''5'''
-|rowspan = "3"|'''Search scope:''' US Granted US Applications EP-A EP-B WO JP DE-C,B DE-A DE-T DE-U GB-A FR-A; <br>'''Claims, Title or Abstract'''<br>'''Years: '''1836-2008
+|align = "center"|Pressure sensitive adhesive automotive
-|(transactional ADJ memory) OR ((transactional ADJ execution) SAME memory)
+|align = "center"|1,406
-|align = "center"|'''167'''
-|
 |-
-|align = "center" bgcolor = "#FFFF99"|'''Other Keywords'''
+|align = "center" bgcolor = "#95B3D7"|'''6'''
-|(atomic<nowiki>*</nowiki>4 NEAR2 memory NEAR2 (transaction<nowiki>*</nowiki>1 OR access<nowiki>*</nowiki>2)) OR (((concurrency ADJ control) OR (concurrent ADJ computing)) WITH ((shared ADJ memory) AND (synchronization OR access<nowiki>*</nowiki>2)))
+|align = "center"|Pressure sensitive adhesive drug delivery
-|align = "center"|'''24'''
+|align = "center"|2,876
-|
 |-
-|align = "center" bgcolor = "#FFFF99"|'''Final'''
+|align = "center" bgcolor = "#C5BE97" colspan = "3"|'''Springerlink'''
-|align = "center"|'''1 OR 2'''
-|align = "center"|'''82 unique (189 patents including families)'''
-|
 |-
-|}<br clear="all">
+|align = "center" bgcolor = "#95B3D7"|'''1'''
+|align = "center"|Pressure sensitive adhesive making
+|align = "center"|2,149
-----
+|-
+|align = "center" bgcolor = "#95B3D7"|'''2'''
+|align = "center"|Pressure sensitive adhesive application
+|align = "center"|3,901
-==IP Trend==
+|-
-*75 patents published in the last 10 years.
+|align = "center" bgcolor = "#C5BE97" colspan = "3"|'''Google images'''
-*Patent filing is more in the last 4 years(75 %)
-[[Image:Year_wise_graph-Transactional_memory.jpg|align|thumb|center|500px|Year wise graph]]
+|-
+|align = "center" bgcolor = "#95B3D7"|'''1'''
+|align = "center"|Pressure sensitive adhesive making
+|align = "center"|3,580,000
-----
+|-
+|align = "center" bgcolor = "#95B3D7"|'''2'''
+|align = "center"|Pressure sensitive adhesive application
+|align = "center"|2,210,000
-==Key companies==
+|-
-* Intel(26 patents) and Sun Microsystems (19 patents) are major players.
+|align = "center" bgcolor = "#95B3D7"|'''3'''
-* Microsoft(11 patents) and IBM(7 patents) are next to them.
+|align = "center"|Pressure sensitive adhesive electronics
+|align = "center"|1,690,000
-[[Image:Assignee_graph-Transactional_memory.jpg|align|thumb|center|500px|Top Assignees]]
+|}
-----
+==Market Information==
+* According to a report from the Business Communications Company, the 2001 US market for specialty adhesives was about $5.7 billion, and is forecast to grow at 4.3% per year, with medical and dental applications being the fastest-growing sector at 5.9% per year. [http://www.marketfile.com/print/paint/title5/index.htm Source]
+* Frost and Sullivan report the size of the European PSA market (medical and non-medical) to be $620 million in 2000, forecast to grow to $796 million in 2007. [http://www.engineeringtalk.com/news/fro/fro122.html Source]
+* The world value of the overall adhesives market is estimated at US $22 billion.
+* '''Total Market Expected to Grow at a CAGR of 9 Percent''': The U.S. PSA markets for labels and narrow-web graphics is expected to growth with a CAGR of 9 percent during the years 2006–2012. The total U.S. PSA markets for labels and narrow-web graphics unit shipments are expected to continue to growth at a CAGR of 6.6 percent due to high end-user growth. The UV technology is a new technology that have started to receive wide acceptance in the industry and that segment of the industry is a fragmented and developing segment with growth rates in double digits. While the solvent-based PSAs are expected to show decreasing growth percents, the water-based and solvent-based segments are expected to growth in the lines of the total industry. [http://www.frost.com/prod/servlet/report-brochure.pag?id=F652-01-00-00-00 Source]
-==Top IPC and US Classes==
+* According to '''World Adhesives File 2000-2005''', the leading handful of adhesives suppliers, including pressure sensitive companies, already controlled almost half the global market in 1999. Henkel leads the way with an estimated 12% global market share, which will probably increase to around 14% with the purchase of Dexter’s adhesives interests. Pressure sensitive suppliers 3M and Avery Dennison are ranked second and third, with 9% and 7% shares respectively, followed jointly by National Starch and H.B. Fuller — both at 6%. The newly enlarged Atofina and Rohm and Haas follow closely behind.” [http://answers.google.com/answers/threadview?id=60487 Source]
-*'''Top IPC class:''' G06F
+* Growth of the world market averages about 2-3% per year.
+* Packaging adhesives make up the majority of the market.
+* The electronic and medical adhesives market is currently experiencing the most rapid growth.
-[[Image:IPC_class-Transactional_memory.jpg|align|thumb|center|500px|IPC class]]
+* Market leaders by country are as follows:
+** United States - approximately 2.6 tonnes annually
+** China
+** Japan
+** Germany
+** UK [[image:players_logo.jpg|right|500 px]]
+* Market leaders by company(which account for one-third of the market share)  are:
+** Henkel
+** 3M
+** Avery Denison
+** HB Fuller
+** National Starch
+** Atofina
-*'''Top US class:''' 711, 707, 712, 717, 718
+==Intellectual Property==
-[[Image:US_class-Transactional_memory.jpg|align|thumb|center|500px|US class]]
+===Patent Search Table===
+{|border="1" cellspacing="0" cellpadding="4" width="100%"
+|colspan = "5"|
+* Patent search on Micropat
+* Databases searched: '''USG USA EPA EPB WO JP DEG DEA DET DEU GBA FRA'''
+|-
+|bgcolor = "#FFFF99"|'''Query.No.'''
+|bgcolor = "#FFFF99"|'''Searched Sections'''
+|bgcolor = "#FFFF99"|'''Years Searched'''
+|bgcolor = "#FFFF99"|'''Query'''
+|bgcolor = "#FFFF99"|'''Hits'''
+|-
+|1
+|Claims, Title or Abstract
+|1836 – Date
+||(rubber OR acryl* OR silicone OR oil*1 OR resin*1 OR ethylen* OR isoprene OR terpene OR copolymer* OR vinyl* OR siloxane* ((acid OR anhydride) ADJ1 (acrylic OR crotonic OR (vinyl ADJ1 acetic) OR fumaric OR maleic OR malonic OR succinic OR itaconic OR citraconic)) OR polymer* OR styrene OR ester*) SAME (((pressure ADJ1 sensitive) NEAR2 (adhesive* OR glue OR paste OR (binding ADJ1 agent) OR (epoxy ADJ1 resin*) OR film) OR PSA OR PSAs) OR (adhesion* WITH (peel OR tensile OR shear) OR stick*) OR (radical* ADJ1 (initiator* OR maker*)))
+|76006
+|-
+|2
+|Claims, Title or Abstract
+|1836 – Date
+|(((low ADJ surface ADJ energy) WITH (substrate*1 OR polymer OR compound* OR material OR film)) OR (surface ADJ1 tension) OR (surface ADJ1 rough*) OR viscosity OR (oily ADJ surface) OR (low ADJ1 energy ADJ1 surface*)) AND (polyolefin*1 OR polyethylene*1 OR polypropylene*1 OR (polyvinyl ADJ1 chloride ADJ1 film) OR (oil ADJ1 contaminated ADJ1 metal) OR polybutene OR polyisoprene*1 OR (polyvinylidene ADJ1 fluoride*) OR polytetrafluoroethylene*1 OR polyester*1 OR polyamide*1 OR polyacetal*1 OR polystyrene*1 OR polyurethane* OR polyurea OR silan* OR polycarbonate*)
+|75602
+|-
+|3
+|Claims, Title or Abstract
+|1836 – Date
+|1 AND 2
+|2272
+|-
+|}
+* Total number of patents - 2272
+* Total number of unique patent families - 1483
-----
+==<span style="color:#C41E3A">Like this report?</span>==
+<p align="center"> '''This is only a sample report with brief analysis''' <br>
+'''Dolcera can provide a comprehensive report customized to your needs'''</p>
+{|border="2" cellspacing="0" cellpadding="4" align="center" "
+|style="background:lightgrey" align = "center"  colspan = "3"|'''[mailto:info@dolcera.com <span style="color:#0047AB">Buy the customized report from Dolcera</span>]'''
+|-
+| align = "center"| [http://www.dolcera.com/website_prod/services/ip-patent-analytics-services Patent Analytics Services]
+|align = "center"| [http://www.dolcera.com/website_prod/services/business-research-services Market Research Services]
+|align = "center"| [http://www.dolcera.com/website_prod/tools/patent-dashboard Purchase Patent Dashboard]
+|-
+|align = "center"| [http://www.dolcera.com/website_prod/services/ip-patent-analytics-services/patent-search/patent-landscapes Patent Landscape Services]
+|align = "center"| [http://www.dolcera.com/website_prod/research-processes Dolcera Processes]
+|align = "center"| [http://www.dolcera.com/website_prod/industries Industry Focus]
+|-
+|align = "center"| [http://www.dolcera.com/website_prod/services/ip-patent-analytics-services/patent-search/patent-landscapes Patent Search Services]
+|align = "center"| [http://www.dolcera.com/website_prod/services/ip-patent-analytics-services/alerts-and-updates Patent Alerting Services]
+|align = "center"| [http://www.dolcera.com/website_prod/tools Dolcera Tools]
+|-
+|}
+<br>
+===Taxonomy for analysis===
+[[Image:adhesion-3Mnew2.jpg|thumb|center|800px|Taxonomy map - Adhesion]]
+===Taxonomy for PSA composition===
+[[Image:adhesion-final version.jpg|thumb|center|800px|Taxonomy map - Adhesion]]
+===IP Activity===
+[[image:Priority year_PSA.jpg|center|600 px|thunb|Competitors]]
+===Major Competitors===
+[[image:competitors_PSA.jpg|center|600 px|thunb|Competitors]]
-==Sample analysis==
+===Composition components matrix===
 {|border="2" cellspacing="0" cellpadding="4" width="100%"
-|align = "center" bgcolor = "#969696"|<font color="#00FFFF">S.No.</font>
+|align = "center" bgcolor = "#C0C0C0"|'''Assignees'''
-|align = "center" bgcolor = "#969696"|<font color="#00FFFF">Patent/Publication No.</font>
+|align = "center" bgcolor = "#C0C0C0"|'''Rubber'''
-|align = "center" bgcolor = "#969696"|<font color="#00FFFF">Title</font>
+|align = "center" bgcolor = "#C0C0C0"|'''Silicone'''
-|align = "center" bgcolor = "#969696"|<font color="#00FFFF">Transactional memory</font>
+|align = "center" bgcolor = "#C0C0C0"|'''Polymers'''
-|align = "center" bgcolor = "#969696"|<font color="#00FFFF">Summary</font>
+|align = "center" bgcolor = "#C0C0C0"|'''Acrylic'''
+|align = "center" bgcolor = "#C0C0C0"|'''Tackifying resin'''
+|align = "center" bgcolor = "#C0C0C0"|'''Plasticizer oil'''
+|align = "center" bgcolor = "#C0C0C0"|'''Carboxylic acids'''
+|align = "center" bgcolor = "#C0C0C0"|'''Acid Esters'''
+|align = "center" bgcolor = "#C0C0C0"|'''Priority Year'''
+|align = "center" bgcolor = "#C0C0C0"|'''Patent numbers'''
 |-
-|align = "center" bgcolor = "#969696"|<font color="#00FFFF">1</font>
+|rowspan = "5"|3M Innovative Properties Company
-|align = "center"|<font color="#0000FF"><u>[http://appft1.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PG01&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.html&r=1&f=G&l=50&s1=%2220040015642%22.PGNR.&OS=DN/20040015642&RS=DN/20040015642 US20040015642A1]</u></font>
+|align = "center"|x
-|Software transactional memory for dynamically sizable shared data structures
+|align = "center"|&nbsp;
-|align = "center"|Dynamic STM (DSTM)
+|align = "center"|x
-|A software transactional memory that allows concurrent non-blocking access to a dynamically sizable data structure defined in shared storage managed by the software transactional memory is described. The implementation is called dynamic software transactional memory (DSTM). DSTM techniques allow transactions and transactional objects to be created dynamically. The non-blocking property considered here is obstruction-freedom.
+|align = "center"|x
+|align = "center"|x
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|2000
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6630531 US6630531]</u></font>
 |-
-|align = "center" bgcolor = "#969696"|<font color="#00FFFF">2</font>
+|align = "center"|x
-|align = "center"|<font color="#0000FF"><u>[http://appft1.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=1&f=G&l=50&d=PG01&p=1&S1=20060085591.PGNR.&OS=DN/20060085591&RS=DN/20060085591 US20060085591A1]</u></font>
+|align = "center"|&nbsp;
-|Hybrid hardware and software implementation of transactional memory access
+|align = "center"|x
-|align = "center"|Phased Transactional Memory (PhTM)
+|align = "center"|x
-|The invention relates to a hybrid hardware and software implementation of transactional memory accesses in a computer system. A processor including a transactional cache and a regular cache is utilized in a computer system that includes a policy manager to select one of a first mode (a hardware mode) or a second mode (a software mode) to implement transactional memory accesses. In the hardware mode the transactional cache is utilized to perform read and write memory operations and in the software mode the regular cache is utilized to perform read and write memory operations.
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|2000
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6632872 US6632872]</u></font>
 |-
-|align = "center" bgcolor = "#969696"|<font color="#00FFFF">3</font>
+|align = "center"|&nbsp;
-|align = "center"|<font color="#0000FF"><u>[http://appft1.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=1&f=G&l=50&d=PG01&p=1&S1=20070028056.PGNR.&OS=DN/20070028056&RS=DN/20070028056 US20070028056A1]</u></font>
+|align = "center"|&nbsp;
-|Direct-update software transactional memory
+|align = "center"|x
-|align = "center"|Dynamic STM (DSTM)
+|align = "center"|x
-|A transactional memory programming interface allows a thread to directly and safely access one or more shared memory locations within a transaction while maintaining control structures to manage memory accesses to those same locations by one or more other concurrent threads. Each memory location accessed by the thread is associated with an enlistment record, and each thread maintains a transaction log of its memory accesses.
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|2000
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6455634 US6455634]</u></font>
 |-
-|align = "center" bgcolor = "#969696"|<font color="#00FFFF">4</font>
+|align = "center"|&nbsp;
-|align = "center"|<font color="#0000FF"><u>[http://appft1.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=1&f=G&l=50&d=PG01&p=1&S1=20070156780.PGNR.&OS=DN/20070156780&RS=DN/20070156780 US20070156780A1]</u></font>
+|align = "center"|&nbsp;
-|Protecting shared variables in a software transactional memory system
+|align = "center"|x
-|align = "center"|Dynamic STM (DSTM)
+|align = "center"|x
-|For a variable accessed at least once in a software-based transactional memory system (STM) defined (STM-defined) critical region of a program, modifying an access to the variable that occurs outside any STM-defined critical region system by starting a hardware based transactional memory based transaction, within the hardware based transactional memory based transaction, checking if the variable is currently owned by a STM transaction, If the variable is not currently owned by a STM transaction, performing the access and then committing the hardware based transactional memory transaction and if the variable is currently owned by a STM transaction, performing a responsive action.
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|x
+|1993
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5612136 US5612136]</u></font>
 |-
-|align = "center" bgcolor = "#969696"|<font color="#00FFFF">5</font>
+|align = "center"|&nbsp;
-|align = "center"|<font color="#0000FF"><u>[http://appft1.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=1&f=G&l=50&d=PG01&p=1&S1=20070156994.PGNR.&OS=DN/20070156994&RS=DN/20070156994 US20070156994A1]</u></font>
+|align = "center"|&nbsp;
-|Unbounded transactional memory systems
+|align = "center"|&nbsp;
-|align = "center"|Unbounded Hardware Transactional Memory (UHTM)
+|align = "center"|x
-|Methods and apparatus to provide unbounded transactional memory systems are described. Transactional memory is implemented through a table lookup mechanism. To access a shared resource, a thread may first check a table stored in memory to determine whether another thread is accessing the same portion of the shared resource. Accessing a table that is stored in memory may generate overhead that decreases performance.
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|x
+|1993
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5602221 US5602221]</u></font>
 |-
-|align = "center" bgcolor = "#969696"|<font color="#00FFFF">6</font>
+|American Tape Company
-|align = "center"|<font color="#0000FF"><u>[http://appft1.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=1&f=G&l=50&d=PG01&p=1&S1=20070239942.PGNR.&OS=DN/20070239942&RS=DN/20070239942 US20070239942A1]</u></font>
+|align = "center"|x
-|Transactional memory virtualization
+|align = "center"|&nbsp;
-|align = "center"|Virtualized Transactional Memory (VTM)
+|align = "center"|&nbsp;
-|Methods and apparatus to provide transactional memory execution in a virtualized mode are described. Data corresponding to a transactional memory access request is stored in a portion of a memory after an operation corresponding to the transactional memory access request causes an overflow and a stored value may be updated for an occurrence of the overflow.
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1997
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5798175 US5798175]</u></font>
 |-
-|align = "center" bgcolor = "#969696"|<font color="#00FFFF">7</font>
+|Ashland Oil, Inc.
-|align = "center"|<font color="#0000FF"><u>[http://appft1.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=1&f=G&l=50&d=PG01&p=1&S1=20070300238.PGNR.&OS=DN/20070300238&RS=DN/20070300238 US20070300238A1]</u></font>
+|align = "center"|x
-|Adapting software programs to operate in software transactional memory environments
+|align = "center"|&nbsp;
-|align = "center"|Dynamic Software Transactional Memory 2.0 (DSTM2)
+|align = "center"|x
-|Software transactional memory is used in non-managed language environments and with legacy codes without requiring a software programmer to change the programming paradigm they are currently used to. STM adapter system automatically transforms all the binary code executed within that block to execute atomically. STM adapter system automatically transforms lock-based critical sections in existing binary code to atomic blocks,
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1991
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5434213 US5434213]</u></font>
 |-
-|align = "center" bgcolor = "#969696"|<font color="#00FFFF">8</font>
+|rowspan = "4"|Atlantic Richfield Company
-|align = "center"|<font color="#0000FF"><u>[http://appft1.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=1&f=G&l=50&d=PG01&p=1&S1=20080005504.PGNR.&OS=DN/20080005504&RS=DN/20080005504 US20080005504A1]</u></font>
+|align = "center"|&nbsp;
-|Global overflow method for virtualized transactional memory
+|align = "center"|&nbsp;
-|align = "center"|Virtualized Transactional Memory (VTM)
+|align = "center"|x
-|A method and apparatus for virtualizing and/or extending transactional memory is described. Transactions are executed using local shared transactional memory, such as a cache memory. Upon overflowing the shared transactional memory, the transactional memory is virtualized and/or extended into a higher-level memory, such as a system memory.
+|align = "center"|x
+|align = "center"|x
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1984
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=4656213 US4656213]</u></font>
 |-
-|align = "center" bgcolor = "#969696"|<font color="#00FFFF">9</font>
+|align = "center"|x
-|align = "center"|<font color="#0000FF"><u>[http://appft1.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=1&f=G&l=50&d=PG01&p=1&S1=20080098374.PGNR.&OS=DN/20080098374&RS=DN/20080098374 US20080098374A1]</u></font>
+|align = "center"|&nbsp;
-|Method and apparatus for performing dynamic optimization for software transactional memory
+|align = "center"|x
-|align = "center"|Dynamic STM (DSTM)
+|align = "center"|x
-|The present invention relates to a method and apparatus for performing dynamic optimization for STM. An optimistically immutable field is determined in the transaction to write. The transaction optimization unit keeps track of the status of object and class fields in a transaction. The transaction optimization unit invalidates methods corresponding to an optimistically immutable field in response to determining that the field has been written to and is therefore not immutable.
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1996
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5817426 US5817426]</u></font>
 |-
-|align = "center" bgcolor = "#969696"|<font color="#00FFFF">10</font>
+|&nbsp;
-|align = "center"|<font color="#0000FF"><u>[http://www.wipo.int/pctdb/en/fetch.jsp?LANG=ENG&DBSELECT=PCT&SERVER_TYPE=19-10&SORT=41253138-KEY&TYPE_FIELD=256&IDB=0&IDOC=1629252&C=10&ELEMENT_SET=B&RESULT=1&TOTAL=1&START=1&DISP=25&FORM=SEP-0/HITNUM,B-ENG,DP,MC,AN,PA,ABSUM-ENG&SEARCH_IA=US2008050081&QUE WO2008088931A2]</u></font>
+|align = "center"|&nbsp;
-|FACILITATING EFFICIENT TRANSACTIONAL MEMORY AND ATOMIC OPERATIONS VIA CACHE LINE MARKING
+|align = "center"|x
-|align = "center"|Hardware-Accelerated STM (HASTM)-Conflict detection
+|align = "center"|x
-|The system starts by executing a transaction for a thread, wherein executing the transaction involves placing load-marks on cache lines which are loaded during the transaction and placing store-marks on cache lines which are stored to during the transaction. Upon completing the transaction, the system releases the load-marks and the store-marks from the cache lines which were load-marked and store-marked during the transaction. Note that during the transaction, the load-marks and store-marks prevent interfering accesses from other threads to the cache lines.
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1996
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5817426 US5817426]</u></font>
+|-
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1997
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6461707 US6461707]</u></font>
+|-
+|Coloplast
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1980
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6437038 US6437038]</u></font>
+|-
+|rowspan = "5"|Dow Corning Corporation
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1970
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5916981 US5916981]</u></font>
+|-
+|&nbsp;
+|align = "center"|x
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1990
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6337086 US6337086]</u></font>
+|-
+|&nbsp;
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1990
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6121368 US6121368]</u></font>
+|-
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1994
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5561203 US5561203]</u></font>
+|-
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1996
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5861472 US5861472]</u></font>
+|-
+|Exxon Chemical Patents Inc.
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1993
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5714254 US5714254]</u></font>
+|-
+|Fujikura Ltd.
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|2000
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6388556 US6388556]</u></font>
+|-
+|General Electric Company
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|2000
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6387487 US6387487]</u></font>
+|-
+|H Fuller Licensing & Financing, Inc.
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|x
+|align = "center"|x
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1996
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5741840 US5741840]</u></font>
+|-
+|H. B. Fuller Licensing & Financing, Inc.
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1997
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5869562 US5869562]</u></font>
+|-
+|Johnson & Johnson Products Inc.
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1981
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=4335026 US4335026]</u></font>
+|-
+|Nichiban Company Limited
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1997
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6274235 US6274235]</u></font>
+|-
+|None
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|x
+|1996
+|<font color="#0000FF"><u>[http://appft1.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PG01&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.html&r=1&f=G&l=50&s1=%2220030136510%22.PGNR.&OS=DN/20030136510&RS=DN/20030136510 US20030136510]</u></font>
+|-
+|PPG Industries, Inc.
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|x
+|align = "center"|&nbsp;
+|1996
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5776548 US5776548]</u></font>
+|-
+|Ralf Korpman Associates, Inc.
+|align = "center"|x
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|align = "center"|&nbsp;
+|1992
+|<font color="#0000FF"><u>[http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5760135 US5760135]</u></font>
 |-
 |}
+===Technology Tree===
+As it is evident from the the technology tree below, although the IP activity in the area of Pressure sensitive adhesive was initiated during 1970s, companies are continuously trying new combinations of different components.
+[[image:Technology tree.jpg|center|500 px]]
+==Key findings==
+* In the medical field, pressure-sensitive adhesive tapes are used for many different applications in the hospital and health areas and also they can be used to adhere two surfaces together such as the flaps of packing material or fabric to a surface
+* In many commercial applications of pressure-sensitive adhesives, it would be preferred to use an acrylate polymer or copolymer having an intrinsic viscosity of at least about 2.5 dl/g
+* Ideally, a process for producing an acrylate-based polymer for a pressure-sensitive adhesive provides a means for controlling both molecular weight, i.e., intrinsic viscosity, and molecular weight distribution.
+* Pressure-sensitive adhesives require a delicate balance of viscous and elastic properties that result in a four-fold balance of adhesion, cohesion, stretchiness and elasticity. Pressure-sensitive adhesives generally comprise elastomers that are either inherently tacky, or elastomers or thermoplastic elastomers that are tackified with the addition of tackifying resins.
-----
+==Analysis Sheet==
+[[Media:Sample analysis sheet.xls|Sample Analysis Sheet]]
-==Patent dashboard==
-'''[https://www.dolcera.com/auth/dashboard/dashboard.php?workfile_id=388 Patent Categorization in Dashboard]'''
 ==<span style="color:#C41E3A">Like this report?</span>==
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Difference between pages "Transactional memory in hardware" and "Pressure sensitive adhesives"

Latest revision as of 06:43, 27 July 2015

Contents

Dashboard

Overview

Surface Energy

Low Surface Energy Substrates

Adhesion

Application of PSA

Application in electronics and electrical industry

Application in automobile industry

Medical applications

PSAs drive transdermal delivery

Application in aerospace industry

Making of PSAs

Effect of important parameters on PSA making and performance

Effect of polymer molecular weight and crosslinking reactions on the end-use properties of PSAs

Effect of composition on Mechanical behaviours and fracture energy of PSAs

Effect of tackifier on PSAs

Effect of chain transfer agent and cross-linker concentration in making of PSAs

Effect of flexible substrates on PSAs performance

PSA performance measurement

Tack

Peel strength

Shear strength

PSA products

Recycling issues with PSA

Search strategy

Market Information

Intellectual Property

Patent Search Table

Like this report?

Taxonomy for analysis

Taxonomy for PSA composition

IP Activity

Major Competitors

Composition components matrix

Technology Tree

Key findings

Analysis Sheet

Like this report?

Contact Dolcera

Navigation menu

Search